US Patent Application 17992241. Optical Communication for Memory Disaggregation in High Performance Computing simplified abstract
Optical Communication for Memory Disaggregation in High Performance Computing
Organization Name
Inventor(s)
Horia Alexandru Toma of Sunnyvale CA (US)
Zuowei Shen of Los Altos CA (US)
Yujeong Shim of Cupertino CA (US)
Jaesik Lee of San Jose CA (US)
Georgios Konstadinidis of San Jose CA (US)
Teckgyu Kang of Saratoga CA (US)
Igor Arsovski of Williston VT (US)
Sukalpa Biswas of Fremont CA (US)
Optical Communication for Memory Disaggregation in High Performance Computing - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17992241 Titled 'Optical Communication for Memory Disaggregation in High Performance Computing'
Simplified Explanation
The abstract describes a technology that separates memory from a specific type of integrated circuit called an ASIC package. In this case, a high-bandwidth memory (HBM) optics module package is connected to the ASIC package using optical links. The HBM optics module package includes HBM dies, HBM chiplets, and an optical chiplet. The optical chiplet connects the HBM optics module to optical fibers, which form an optical link with other components of the ASIC package. By including the optical chiplet, the HBM optics module package can be separated from the ASIC package.
Original Abstract Submitted
The technology generally relates to disaggregating memory from an application specific integrated circuit (“ASIC”) package. For example, a high-bandwidth memory (“HBM”) optics module package may be connected to an ASIC package via one or more optical links. The HBM optics module package may include HBM dies(s), HBM chiplet(s) and an optical chiplet. The optical chiplet may be configured to connect the HBM optics module to one or more optical fibers that form an optical link with one or more other components of the ASIC package. By including an optical chiplet in the HBM optics module package, the HBM optics module package may be disaggregated from an ASIC package.
