US Patent Application 17984446. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Inventors
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for patent application number 17984446 Titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME'
Simplified Explanation
The abstract describes semiconductor devices and how they are made. These devices have a pad on a semiconductor chip, which is covered by a protective layer with an opening that exposes part of the pad's top surface. The device also includes a bump structure that is electrically connected to the pad. The bump structure consists of a metal layer on the pad and a solder ball on top of the metal layer. The width of the metal layer is between 0.85 and 0.95 times the width of the opening in the protective layer.
Original Abstract Submitted
Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises a pad on a semiconductor chip, a protective layer on the semiconductor chip and having an opening that exposes a portion of a top surface of the pad, and a bump structure electrically connected to the pad. The bump structure includes a metal layer on the pad and a solder ball on the metal layer. A first width of the metal layer is about 0.85 times to about 0.95 times a second width of the opening.
