US Patent Application 17974281. FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING simplified abstract

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FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING

Organization Name

Applied Materials, Inc.

Inventor(s)

Chad Pollard of San Jose CA (US)

Shou-Sung Chang of Mountain View CA (US)

Haosheng Wu of San Jose CA (US)

FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17974281 titled 'FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROCESSING

Simplified Explanation

- The patent application describes a chemical mechanical polishing assembly that includes a system for polishing materials. - The assembly includes a fluid source and a conduit to deliver fluid from the source to the polishing system. - The polishing system consists of a platen, a carrier head, and a motor to create motion between them. - The fluid delivery conduit has a conductive wire inside it to discharge electrostatic energy to the ground. - A wire extraction fitting is used to cover and seal the location where the conductive wire passes through the conduit wall.

  • The patent application describes a chemical mechanical polishing assembly.
  • The assembly includes a fluid source and a conduit for fluid delivery.
  • The polishing system consists of a platen, a carrier head, and a motor.
  • The fluid delivery conduit has a conductive wire for electrostatic discharge.
  • A wire extraction fitting is used to cover and seal the conduit wall.


Original Abstract Submitted

A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.

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