US Patent Application 17971907. DIRECT COOLING TYPE POWER MODULE simplified abstract
Contents
DIRECT COOLING TYPE POWER MODULE
Organization Name
Inventor(s)
Suk Hyun Lim of Hwaseong-si (KR)
Tae Hwa Kim of Hwaseong-si (KR)
DIRECT COOLING TYPE POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17971907 titled 'DIRECT COOLING TYPE POWER MODULE
Simplified Explanation
The abstract describes a direct cooling type power module that includes an enclosure filled with an insulating fluid, a power semiconductor device inside the enclosure, and a bonding unit consisting of a porous layer and a thermally conductive layer. The bonding unit allows the power semiconductor device to exchange heat with the insulating fluid.
- The power module is designed for direct cooling, meaning it allows for efficient heat exchange between the power semiconductor device and the insulating fluid.
- The enclosure is filled with an insulating fluid to provide thermal insulation and prevent any electrical issues.
- The power semiconductor device is bonded to a bonding unit, which consists of a porous layer and a thermally conductive layer.
- The porous layer and the thermally conductive layer enable heat transfer between the power semiconductor device and the insulating fluid.
- This design ensures effective cooling of the power semiconductor device, preventing overheating and improving overall performance.
Original Abstract Submitted
A direct cooling type power module comprising, an enclosure filled with an insulating fluid, a power semiconductor device disposed inside the enclosure and a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer.
