US Patent Application 17969189. MULTILAYER ELECTRONIC COMPONENT simplified abstract

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MULTILAYER ELECTRONIC COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Seon Ho Park of Suwon-si (KR)

Jae Seok Yi of Suwon-si (KR)

Moon Soo Park of Suwon-si (KR)

Chang Hak Choi of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17969189 titled 'MULTILAYER ELECTRONIC COMPONENT

Simplified Explanation

The patent application describes a multilayer electronic component that includes a body with multiple dielectric layers and internal electrodes.

  • The component also has external electrodes that are connected to the internal electrodes.
  • A metal oxide, which contains calcium, zinc, and silicon, is placed between the body and the external electrodes.
  • The metal oxide also includes at least one of barium, boron, or aluminum.


Original Abstract Submitted

A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).