US Patent Application 17951625. PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE simplified abstract

From WikiPatents
Jump to navigation Jump to search

PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE

Organization Name

CHANGXIN MEMORY TECHNOLOGIES, INC.

Inventor(s)

Honglong Shi of Hefei City (CN)

Maosong Ma of Hefei City (CN)

Jianbin Liu of Hefei City (CN)

PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17951625 titled 'PACKAGE SUBSTRATE, APPARATUS FOR TESTING POWER SUPPLY NOISE AND METHOD FOR TESTING POWER SUPPLY NOISE

Simplified Explanation

The patent application describes a package substrate, apparatus, and method for testing power supply noise.

  • The package substrate has multiple pad arrays, each containing power supply pads.
  • Power supply pads of the same type in the multiple pad arrays are divided into a test pad and a power supply pad set.
  • The power supply pad set includes all power supply pads, except the test pad, of the same type, and they are electrically connected together.
  • The test pad is used to perform noise testing of at least one internal power supply in a chip to be tested.
  • The invention simplifies the testing process for power supply noise by grouping power supply pads and providing a dedicated test pad.


Original Abstract Submitted

A package substrate, an apparatus for testing power supply noise, and a method for testing power supply noise are provided. The package substrate includes multiple pad arrays, and each of the multiple pad arrays at least includes power supply pads. Power supply pads belonging to a same power supply type in the multiple pad arrays are divided into a test pad and a power supply pad set. The power supply pad set includes power supply pads, other than the test pad, among the power supply pads belonging to the same power supply type, all the power supply pads in the power supply pad set are electrically connected together, and the test pad is configured to perform noise testing of at least one internal power supply corresponding to the same power supply type in a chip to be tested.

Retrieved from "http://wikipatents.org/index.php?title=US_Patent_Application_17951625._PACKAGE_SUBSTRATE,_APPARATUS_FOR_TESTING_POWER_SUPPLY_NOISE_AND_METHOD_FOR_TESTING_POWER_SUPPLY_NOISE_simplified_abstract&oldid=10853"