US Patent Application 17904220. CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD simplified abstract

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CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD

Organization Name

Samsung Electronics Co., Ltd.


Inventor(s)

Bumhee Bae of Suwon-si (KR)

Sungsoo Kim of Suwon-si (KR)

Kwangmo Yang of Suwon-si (KR)

CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 17904220 titled 'CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD

Simplified Explanation

The patent application describes an electronic device with a circuit board that connects two electric elements.

  • The circuit board has three portions - a first portion, a second portion, and a third portion.
  • The second and third portions extend from the first portion.
  • The circuit board includes signal lines, ground patterns, and conductive vias.
  • The signal lines connect the second and third portions.
  • The ground patterns also connect the second and third portions.
  • The first conductive vias connect the ground patterns at the second portion.
  • The second conductive vias connect the ground patterns at the third portion.
  • The ground patterns have a meander form at the first portion.


Original Abstract Submitted

An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.