US Patent Application 17903070. METHOD VERIFYING PROCESS PROXIMITY CORRECTION USING MACHINE LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME simplified abstract
METHOD VERIFYING PROCESS PROXIMITY CORRECTION USING MACHINE LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME
Inventors
METHOD VERIFYING PROCESS PROXIMITY CORRECTION USING MACHINE LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME - A simplified explanation of the abstract
- This abstract for appeared for patent application number 17903070 Titled 'METHOD VERIFYING PROCESS PROXIMITY CORRECTION USING MACHINE LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME'
Simplified Explanation
The abstract describes a method of manufacturing a semiconductor chip. It involves generating a layout pattern and then applying Process Proximity Correction (PPC) to the pattern. This correction is verified using machine learning. Optical Proximity Correction (OPC) is then applied to the corrected pattern to generate an OPC layout pattern. A mask is manufactured using this pattern, and finally, a semiconductor chip is manufactured using the mask.
Original Abstract Submitted
A method of manufacturing a semiconductor chip includes; generating a layout pattern, performing Process Proximity Correction (PPC) on the layout pattern to generate a PPC layout pattern, wherein the performing of PPC includes verifying the PPC layout pattern using machine learning, performing Optical Proximity Correction (OPC) on the PPC layout pattern to generate an OPC layout pattern, manufacturing a mask using the OPC layout pattern, and manufacturing a semiconductor chip using the mask.
