US Patent Application 17900193. SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER AND METHOD OF FABRICATING ELECTRONIC APPARATUS simplified abstract
Jump to navigation
Jump to search
Contents
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER AND METHOD OF FABRICATING ELECTRONIC APPARATUS
Organization Name
Inventor(s)
Seogwoo Hong of Yongin-si (KR)
Junsik Hwang of Hwaseong-si (KR)
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER AND METHOD OF FABRICATING ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17900193 titled 'SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER AND METHOD OF FABRICATING ELECTRONIC APPARATUS
Simplified Explanation
The patent application describes a semiconductor device and a method of fabricating an electronic apparatus using the semiconductor device.
- The semiconductor device includes a semiconductor device layer with at least one electrode on the top.
- The device also includes a passivation layer that partially covers the electrode.
- The passivation layer helps protect the electrode from external factors and ensures its proper functioning.
- The method of fabricating the electronic apparatus involves creating the semiconductor device layer with the electrode.
- The passivation layer is then applied to cover and protect the electrode.
- This innovation improves the reliability and performance of the semiconductor device by providing a protective layer for the electrode.
Original Abstract Submitted
Provided are a semiconductor device including a passivation layer and a method of fabricating an electronic apparatus including the semiconductor device. The semiconductor device includes a semiconductor device layer including at least one electrode provided at an upper portion thereof and a passivation layer at least partially covering the at least one electrode.
