US Patent Application 17871887. DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES simplified abstract
Contents
DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
David Abraham of Croton NY (US)
John Michael Cotte of New Fairfield CT (US)
DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17871887 titled 'DOWNSTOP AND BUMP BONDS FORMATION ON SUBSTRATES
Simplified Explanation
The patent application describes an electronic structure with a first substrate and a second substrate joined together using solder bumps and a downstop.
- The electronic structure has a first substrate with two regions called under bump metallization (UBM) regions.
- Solder bumps are deposited onto one of the UBM regions.
- The second UBM region has a wider, shallower, and more rigid downstop compared to the solder bumps.
- The second substrate is connected to the first substrate using the solder bumps on the first UBM region.
- The height of the downstop controls the distance between the first and second substrates or between an object and the substrates.
Original Abstract Submitted
An electronic structure includes a first substrate having a first under bump metallization (UBM) region and a second UBM region formed thereon. One or more solder bumps is deposited onto the first UBM region. A downstop formed on the second UBM region is wider, shallower and more rigid than any one of the solder bumps formed on the first UBM region. A second substrate is joined to the first substrate by the one or more solder bumps located on the first UBM region, and a height of the downstop limits a distance between at least one of the first substrate and the second substrate, or between an object and at least one of the first substrate and the second substrate.
