View source for US Patent Application 17861151. ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES simplified abstract

=ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES=


==Organization Name==

[[INTERNATIONAL BUSINESS MACHINES CORPORATION]]


==Inventor(s)==

[[David Abraham of Croton NY (US)]]

[[John Michael Cotte of New Fairfield CT (US)]]

[[Nicholas A. Masluk of Putnam Valley NY (US)]]

==ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17861151 titled 'ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES

==Simplified Explanation==

The abstract describes a cryogenic electronics device that includes a semiconductor chip.
* The device has a substrate that is flip-chip bonded to the semiconductor chip.
* A bump region on the semiconductor chip contains a concentration of bump bonds.
* The semiconductor chip also has a predefined region where a plurality of circuit elements are arranged.
* The predefined region and the bump region are separate regions on the semiconductor chip.


==Original Abstract Submitted==

A cryogenic electronics device includes a semiconductor chip. A substrate is flip-chip bonded to the semiconductor chip. A plurality of bump bonds are concentrated in a bump region of the semiconductor chip. A plurality of circuit elements are arranged in a predefined region of the semiconductor chip. The predefined region and the bump region are separate regions.