US Patent Application 17861151. ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES simplified abstract

ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

David Abraham of Croton NY (US)

John Michael Cotte of New Fairfield CT (US)

Nicholas A. Masluk of Putnam Valley NY (US)

ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17861151 titled 'ELECTRICAL CONNECTIONS BETWEEN DISSIMILAR MATERIALS AT CRYOGENIC TEMPERATURES

Simplified Explanation

The abstract describes a cryogenic electronics device that includes a semiconductor chip.

• The device has a substrate that is flip-chip bonded to the semiconductor chip.
• A bump region on the semiconductor chip contains a concentration of bump bonds.
• The semiconductor chip also has a predefined region where a plurality of circuit elements are arranged.
• The predefined region and the bump region are separate regions on the semiconductor chip.

Original Abstract Submitted

A cryogenic electronics device includes a semiconductor chip. A substrate is flip-chip bonded to the semiconductor chip. A plurality of bump bonds are concentrated in a bump region of the semiconductor chip. A plurality of circuit elements are arranged in a predefined region of the semiconductor chip. The predefined region and the bump region are separate regions.