US Patent Application 17853867. CONNECTION SCHEME WITH BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract
Contents
CONNECTION SCHEME WITH BACKSIDE POWER DISTRIBUTION NETWORK
Organization Name
Inventor(s)
Seungyoung Lee of Clifton Park NY (US)
Kang-ill Seo of Albany NY (US)
CONNECTION SCHEME WITH BACKSIDE POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract
'This abstract first appeared for US patent application 17853867 titled 'CONNECTION SCHEME WITH BACKSIDE POWER DISTRIBUTION NETWORK'
Simplified Explanation
The abstract describes a system that is used to route connections to a logic circuit. The system includes a wafer with a frontside and a backside. At the backside of the wafer, there is a power conductor and a signal pad. At the frontside of the wafer, there is a core and a first frontside signal-routing metal. The power conductor is connected to the core through a power via, and the signal pad is connected to the first frontside signal-routing metal through a signal via.
Original Abstract Submitted
Provided is a system for routing connections to a logic circuit, the system including a first wafer having a backside and a frontside opposite the backside, a power conductor at the backside of the first wafer, a core at the frontside of the first wafer, a power via electrically connected to the power conductor and to the core, a signal pad at the backside of the first wafer, a first frontside signal-routing metal at the frontside of the first wafer, and a signal via connected to the signal pad and the first frontside signal-routing metal.
