US Patent Application 17829243. INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME simplified abstract

INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Chang-Jung Hsueh of Taipei (TW)]]

[[Category:Yen Wei Chang of Taipei City (TW)]]

[[Category:Cheng-Nan Lin of Hsinchu City (TW)]]

[[Category:Wei-Hung Lin of Xinfeng Township (TW)]]

[[Category:Ming-Da Cheng of Taoyuan (TW)]]

INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17829243 titled 'INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME

Simplified Explanation

The patent application describes a method for creating a heat dissipating structure for a semiconductor chip.

• A soldering material is placed on the top surface of the chip.
• A metal plating is formed on the surface of a lid, with dimensions larger than the chip's surface.
• The lid is placed over the chip, with the metal plating on top of the soldering material.
• The lid is bonded to the chip using a soldering material layer that has an inverted trapezoidal shape.

Original Abstract Submitted

In a method of forming a heat dissipating structure for a semiconductor chip, a soldering material is disposed on a top surface of the semiconductor chip. A first region of metal plating is formed on a surface of a lid. The first region has a first width and a first length. The first width is larger than a second width of the top surface of the semiconductor chip and the first length is larger than a second length of the top surface of the semiconductor chip. The lid is placed over the semiconductor chip so that the first region of metal plating of the lid is disposed over the soldering material to bond the lid to the semiconductor chip by a soldering material layer having an inverted trapezoidal shape between the lid and the top surface of the semiconductor chip.