US Patent Application 17819381. Semiconductor Device and Method of Manufacture simplified abstract
Jump to navigation
Jump to search
Contents
Semiconductor Device and Method of Manufacture
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Jie Chen of New Taipei City (TW)
Sheng-Han Tsai of Hsinchu (TW)
Yuan Sheng Chiu of Miaoli (TW)
Yu Kuei Yeh of New Taipei (TW)
Tsung-Shu Lin of New Taipei City (TW)
Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 17819381 titled 'Semiconductor Device and Method of Manufacture
Simplified Explanation
The patent application describes a semiconductor device and its manufacturing process.
- The device includes a first pad and a second pad that are located next to each other.
- A set of dummy pads is created between the first and second pads.
- Bonding pads are formed to establish electrical connections with the first and second pads.
Original Abstract Submitted
A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.
