US Patent Application 17804061. Vertical Microstrip-to-Waveguide Transition simplified abstract
Contents
Vertical Microstrip-to-Waveguide Transition
Organization Name
Inventor(s)
Syed An Nazmus Saqueb of Westfield IN (US)
Biswadeep Das Gupta of Noblesville IN (US)
Kevin Harnist of Huntley IL (US)
Vertical Microstrip-to-Waveguide Transition - A simplified explanation of the abstract
This abstract first appeared for US patent application 17804061 titled 'Vertical Microstrip-to-Waveguide Transition
Simplified Explanation
- The patent application describes techniques and systems for a vertical microstrip-to-waveguide transition. - The system includes a radar system with a monolithic microwave integrated circuit (MIMIC) and a printed circuit board (PCB). - The PCB has a microstrip and a grounding pattern on its first surface. - The microstrip connects to the MIMIC, while the grounding pattern is made of conductive material. - The system also includes a transition channel positioned over the grounding pattern, which has a vertical taper between a bottom surface and a top surface. - The transition channel forms a dielectric-filled portion using the grounding pattern and its interior surface. - This vertical transition allows for reduced manufacturing costs and supports a wide bandwidth. - It can tolerate an air gap at the transition-to-waveguide interface.
Original Abstract Submitted
This document describes techniques and systems for a vertical microstrip-to-waveguide transition. A radar system may include a monolithic microwave integrated circuit (MIMIC) to generate electromagnetic signals and a printed circuit board (PCB) that includes a first surface, a microstrip, and a grounding pattern. The microstrip can be located on the first surface and operatively connect to the MIMIC. The grounding pattern is located on the first surface and made of conductive material. The radar system also includes a transition channel positioned over the grounding pattern, which includes a vertical taper between a bottom surface and a top surface. The transition channel defines a dielectric-filled portion formed by the grounding pattern and its interior surface. The described vertical transition can reduce manufacturing costs and support a wide bandwidth by tolerating an air gap at the transition-to-waveguide interface.
