US Patent Application 17752868. METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract
Contents
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Organization Name
Inventor(s)
Kai Cheng of Miao-Li County (TW)
Fang-Ying Lin of Miao-Li County (TW)
Tsau-Hua Hsieh of Miao-Li County (TW)
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17752868 titled 'METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Simplified Explanation
- The patent application describes a method of manufacturing an electronic device. - The method involves providing a plurality of first electronic components. - These first electronic components are then transferred onto a plurality of pickup sites. - An empty pickup site is identified, where no first electronic components are present. - A second electronic component is transferred onto the empty pickup site. - A target substrate is provided. - Both the plurality of first electronic components and the second electronic component are transferred onto the target substrate.
Original Abstract Submitted
A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.
