US Patent Application 17752642. MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA simplified abstract

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MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA

Organization Name

NANYA TECHNOLOGY CORPORATION

Inventor(s)

SHING-YIH Shih of NEW TAIPEI CITY (TW)

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 17752642 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA

Simplified Explanation

The patent application describes a method of manufacturing a semiconductor structure.

  • The method involves providing a wafer with a substrate, a dielectric layer, and a conductive pad.
  • A passivation layer is then applied over the substrate.
  • Portions of the dielectric layer, substrate, and passivation layer are removed to expose the conductive pad.
  • A conductive material and an elastic material are then placed within the exposed area.
  • Portions of the conductive and elastic materials are removed to create an elastic member.
  • Finally, a second conductive material is applied over the elastic member and the conductive material to create a conductive via surrounding the elastic member.


Original Abstract Submitted

A method of manufacturing a semiconductor structure includes: providing a first wafer including a first substrate, a first dielectric layer under the first substrate, and a first conductive pad surrounded by the first dielectric layer; disposing a first passivation layer over the first substrate; removing portions of the first dielectric layer, the first substrate and the first passivation layer to form a first opening exposing a portion of the first conductive pad; disposing a first conductive material within the first opening; disposing a first elastic material within the first opening and surrounded by the first conductive material; removing portions of the first conductive material and the first elastic material adjacent to an end of the first opening to form a first elastic member; and disposing a second conductive material over the first elastic member and the first conductive material to form a first conductive via surrounding the first elastic member.

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