US Patent Application 17751185. Apparatus and Methods for Cleaning a Package simplified abstract
Contents
Apparatus and Methods for Cleaning a Package
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Ying-Hao Wang of Tainan City (TW)
Chien-Lung Chen of Zhubei City (TW)
Chien-Chi Tzeng of Hsinchu (TW)
Meng-Fu Shih of Taichung City (TW)
Apparatus and Methods for Cleaning a Package - A simplified explanation of the abstract
This abstract first appeared for US patent application 17751185 titled 'Apparatus and Methods for Cleaning a Package
Simplified Explanation
The patent application describes an apparatus for cleaning a package device.
- The apparatus includes a package device loader and unloader.
- There is a first cleaning area between the loader and unloader.
- The apparatus also includes a conveyor with a frame and a belt.
- The belt wraps around the frame and has a movable upper surface.
- The movable upper surface moves over the frame.
- In the first cleaning area, the distance between the movable upper surface and the frame increases from the loader to the unloader.
Original Abstract Submitted
An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.
