US Patent Application 17750951. DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS simplified abstract

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DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Ming-Che Lee of Tainan City (TW)

Kuo-Ming Wu of Zhubei City (TW)

Sheng-Chau Chen of Tainan City (TW)

Ping-Tzu Chen of Tainan City (TW)

DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17750951 titled 'DUAL BLADE CONFIGURATION FOR WAFER EDGE TRIMMING PROCESS

Simplified Explanation

The patent application describes a method for bonding two wafers together and then removing a portion of the top wafer.

  • The method involves bonding a first wafer to a second wafer to create a wafer stack.
  • The top portion of the second wafer is then removed.
  • A first trim blade is used to create a trench that separates the central portion of the second wafer from the peripheral portion.
  • The trench is located a certain distance from the outer perimeter of the second wafer and extends from the top surface of the second wafer to a certain depth beneath the top surface of the first wafer.
  • A second trim blade, with a wider blade width than the first trim blade, is used to remove the peripheral portion of the second wafer.


Original Abstract Submitted

In some embodiments, the present disclosure relates to a method that includes bonding a first wafer to a second wafer to form a wafer stack and removing a top portion of the second wafer. A first trim blade having a first blade width is aligned over the second wafer. The first trim blade is used to form a trench that separates a central portion of the second wafer from a peripheral portion of the second wafer. The trench is arranged at a first distance from an outer perimeter of the second wafer, and extends from a top surface of the second wafer to a trench depth beneath the top surface of the first wafer. A second trim blade having a second blade width is aligned over the peripheral portion, the second blade width being greater than the first blade width. The peripheral portion is removed using the second trim blade.

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