US Patent Application 17750148. SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT simplified abstract
Contents
SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Yu-Ling Chang Chien of Hsinchu (TW)
Ching-Yu Chang of Hsinchu (TW)
Chin-Hsiang Lin of Hsinchu (TW)
SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 17750148 titled 'SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT
Simplified Explanation
The patent application describes a system and method for using directed self-assembly films to create features on a wafer.
- The system utilizes block copolymers and solvents to form these features.
- The solvents used have high boiling points, allowing for the use of high temperature, rapid thermal annealing processes.
- This process generates a pattern of first and second polymer structures on the wafer.
- The pattern of these structures can then be used to create the desired features on the wafer.
Original Abstract Submitted
A system and method utilize directed self-assembly films, including block copolymers and solvents, to form features on a wafer. The solvents have high boiling points. The high boiling points of the solvents enable directed self-assembly processes to utilize very high temperature, rapid thermal annealing processes to generate a pattern of first and second polymer structures over a wafer from the directed self-assembly films. The pattern of the first and second polymer structures can be utilized to form the features on the wafer.
