US Patent Application 17747939. LITHOGRAPHY SYSTEM AND METHODS simplified abstract
Contents
LITHOGRAPHY SYSTEM AND METHODS
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Shang-Chieh Chien of Hsinchu (TW)
Wei-Shin Cheng of Hsinchu (TW)
Ming-Hsun Tsai of Hsinchu (TW)
Jyun-Yan Chuang of Hsinchu (TW)
LITHOGRAPHY SYSTEM AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17747939 titled 'LITHOGRAPHY SYSTEM AND METHODS
Simplified Explanation
The patent application describes a method for lithography, a process used in semiconductor manufacturing.
- The method involves depositing a mask layer on a substrate.
- Radiation reflected from a collector of a lithography system is directed towards the mask layer based on a specific pattern.
- A blocking structure, attached to a reflector of the lithography system, blocks a portion of the radiation.
- The mask layer is then selectively removed in regions exposed to the radiation, creating openings.
- Material from a layer beneath the mask layer is removed through the openings.
Original Abstract Submitted
A method includes: depositing a mask layer over a substrate; directing radiation reflected from a collector of a lithography system toward the mask layer according to a pattern; blocking a portion of the radiation by a blocking structure, the blocking structure being attached to a reflector of the lithography system; forming openings in the mask layer by removing regions of the mask layer exposed to the radiation; and removing material of a layer underlying the mask layer exposed by the openings.
