US Patent Application 17740292. MECHANICALLY TOLERANT COUPLERS simplified abstract
Contents
MECHANICALLY TOLERANT COUPLERS
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
Timothy Phung of Milpitas CA (US)
Muir Kumph of Croton on Hudson NY (US)
MECHANICALLY TOLERANT COUPLERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17740292 titled 'MECHANICALLY TOLERANT COUPLERS
Simplified Explanation
The patent application describes a modular electronic structure that consists of two chips.
- The first chip has a section called the first interleaved portion and a first electromagnetic coupler.
- The second chip has a section called the second interleaved portion and a second electromagnetic coupler.
- The first and second electromagnetic couplers are designed to connect with each other through electromagnetic coupling.
- The first interleaved portion of the first chip fits between two surfaces of the second chip.
- Similarly, the second interleaved portion of the second chip fits between two surfaces of the first chip.
Original Abstract Submitted
A modular electronic structure includes a first chip having a first interleaved portion and a first electromagnetic coupler on the first interleaved portion. There is a second chip having a second interleaved portion and a second electromagnetic coupler on the second interleaved portion and configured to electromagnetically couple with the first electromagnetic coupler. The first interleaved portion fits between two surfaces of the second chip. The second interleaved portion fits between two surfaces of the first chip.
