US Patent Application 17740279. MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION simplified abstract

MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

David Abraham of Croton NY (US)

John Michael Cotte of New Fairfield CT (US)

Muir Kumph of Croton on Hudson NY (US)

MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17740279 titled 'MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION

Simplified Explanation

The abstract describes a quantum computing chip module that includes an interposer chip, a qubit chip, and a wiring harness.

• The interposer chip has a specific size or footprint.
• The qubit chip is bonded to the interposer chip and extends beyond the footprint of the interposer chip.
• The interposer chip extends beyond an edge of the qubit chip.
• A wiring harness is connected to the interposer chip.
• The innovation lies in the arrangement of the qubit chip, which extends beyond the interposer chip's footprint, and the interposer chip extending beyond the qubit chip's edge.
• This arrangement allows for a more efficient and compact design of the quantum computing chip module.
• The wiring harness is connected to the interposer chip to facilitate the necessary electrical connections for the quantum computing operations.

Original Abstract Submitted

A quantum computing (QC) chip module includes an interposer chip having a footprint. A qubit chip bump is bonded to the interposer chip and arranged so that the qubit chip extends beyond the footprint of the interposer chip. The interposer chip extends beyond an edge of the qubit chip. A wiring harness is connected to the interposer chip.