US Patent Application 17738023. PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract

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PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Wei-Yu Chen of Hsinchu City (TW)

Yu-Min Liang of Taoyuan City (TW)

Hao-Cheng Hou of Hsinchu City (TW)

Tsung-Ding Wang of Tainan (TW)

Chien-Hsun Lee of Hsin-chu County (TW)

Chung-Shi Liu of Hsinchu City (TW)

Jung-Wei Cheng of Hsinchu City (TW)

PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17738023 titled 'PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The patent application describes a substrate structure that includes several components such as a core substrate, a redistribution layer, test pads, a protective coating, a conductive pad, and a passive device.

  • The substrate structure consists of a core substrate, which serves as the main foundation.
  • A redistribution layer is placed on top of the core substrate and is electrically connected to it.
  • Test pads are located on the redistribution layer, providing a means for testing and measuring electrical signals.
  • A protective coating is applied to the test pads, ensuring their durability and preventing damage.
  • A conductive pad is positioned on the redistribution layer alongside the test pads, serving as a connection point for electrical signals.
  • A passive device is placed on the conductive pad and is electrically connected to it, allowing for the manipulation or control of electrical signals.


Original Abstract Submitted

A substrate structure includes a core substrate, a redistribution layer, a plurality of test pads, a first protective coating, at least one conductive pad and a passive device. The redistribution layer is disposed on and electrically connected to the core substrate. The test pads are disposed over the redistribution layer. The first protective coating is coated on the test pads. The conductive pad is d disposed on the redistribution layer aside the plurality of test pads. The passive device is disposed on and electrically connected to the at least one conductive pad.

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