US Patent Application 17738016. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract

From WikiPatents
Jump to navigation Jump to search

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Wei-Huan Fu of Tainan (TW)

Ying-Tsung Chen of Tainan City (TW)

Jiun-Jie Huang of Kaohsiung City (TW)

Wen-Han Hung of Tainan City (TW)

Jen-Pan Wang of Tainan (TW)

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17738016 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Simplified Explanation

The patent application describes a semiconductor device with multiple layers and pads for electrical connections.

  • The device layer is placed on a substrate and has a top metal feature.
  • A first passivation layer is added on top of the device layer.
  • An aluminum pad is inserted through the first passivation layer and connected to the top metal feature.
  • A second passivation layer is then applied over the aluminum pad.
  • An under-ball metallurgy (UBM) pad is inserted through the second passivation layer and connected to the aluminum pad.
  • Finally, a connector is placed on top of the UBM pad.
  • The aluminum pad has a greater angle between its sidewall and bottom compared to the UBM pad.


Original Abstract Submitted

A semiconductor device includes a device layer, a first passivation layer, an aluminum pad, a second passivation layer, an under-ball metallurgy (UBM) pad and a connector. The device layer is disposed over a substrate, wherein the device layer includes a top metal feature. The first passivation layer is disposed over the device layer. The aluminum pad penetrates through the first passivation layer and is electrically connected to the top metal feature. The second passivation layer is disposed over the aluminum pad. The UBM pad penetrates through the second passivation layer and is electrically connected to the aluminum pad. The connector is disposed over the UBM pad. In some embodiments, a first included angle between a sidewall and a bottom of the aluminum pad is greater than a second included angle between a sidewall and a bottom of the UBM pad.

Retrieved from "http://wikipatents.org/index.php?title=US_Patent_Application_17738016._SEMICONDUCTOR_DEVICE_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=6745"