US Patent Application 17735075. PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRISING A TRAPEZOID SHAPED CROSS SECTION simplified abstract
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRISING A TRAPEZOID SHAPED CROSS SECTION
Organization Name
Inventor(s)
Chin-Kwan Kim of San Diego CA (US)
Joan Rey Villarba Buot of Escondido CA (US)
Zhijie Wang of San Diego CA (US)
Marcus Hsu of San Diego CA (US)
Sang-Jae Lee of San Diego CA (US)
Kuiwon Kang of San Diego CA (US)
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRISING A TRAPEZOID SHAPED CROSS SECTION - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17735075 Titled 'PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRISING A TRAPEZOID SHAPED CROSS SECTION'
Simplified Explanation
The abstract describes a package that includes a substrate and an integrated device. The substrate has multiple layers, including a dielectric layer and interconnects. One type of interconnect, called a bump pad interconnect, has a trapezoid shape. The integrated device is connected to the substrate through these bump pad interconnects, which are located within a cavity in the dielectric layer.
Original Abstract Submitted
A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a bump pad interconnect. The bump pad interconnect comprises a profile cross section that has a trapezoid shape. The integrated device is coupled to the substrate through the bump pad interconnect. The bump pad interconnect is located in a cavity of the at least one dielectric layer of the substrate.
