US Patent Application 17731781. Shared Pick-Up Regions for Memory Devices simplified abstract

Shared Pick-Up Regions for Memory Devices

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chih-Chuan Yang of Hsinchu City (TW)

Chao-Yuan Chang of New Taipei City (TW)

Shih-Hao Lin of Hsinchu City (TW)

Chia-Hao Pao of Kaohsiung City (TW)

Feng-Ming Chang of Zhubei City (TW)

Lien-Jung Hung of Taipei (TW)

Ping-Wei Wang of Hsinchu City (TW)

Shared Pick-Up Regions for Memory Devices - A simplified explanation of the abstract

This abstract first appeared for US patent application 17731781 titled 'Shared Pick-Up Regions for Memory Devices

Simplified Explanation

The abstract describes a memory structure with a memory cell array and various components.

• The memory cell array consists of memory cells and first n-type wells that extend in a specific direction.
• There is also a second n-type well located in the peripheral region of the memory structure.
• The second n-type well extends in a different direction and is in contact with one of the first n-type wells.
• A pick-up region is formed within the second n-type well and is electrically connected to the first n-type well.

Original Abstract Submitted

The present disclosure describes a memory structure including a memory cell array. The memory cell array includes memory cells and first n-type wells extending in a first direction. The memory structure also includes a second n-type well formed in a peripheral region of the memory structure. The second n-type well extends in a second direction and is in contact with a first n-type well of the first n-type wells. The memory structure further includes a pick-up region formed in the second n-type well. The pick-up region is electrically coupled to the first n-type well of first n-type wells.