US Patent Application 17729800. PCB STIFFENING STRUCTURE TO PREVENT WARPING simplified abstract
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Contents
PCB STIFFENING STRUCTURE TO PREVENT WARPING
Organization Name
Inventor(s)
Sandor Farkas of Round Rock TX (US)
Bhyrav Mutnury of Austin TX (US)
Daniel J. Carey of Austin TX (US)
PCB STIFFENING STRUCTURE TO PREVENT WARPING - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17729800 Titled 'PCB STIFFENING STRUCTURE TO PREVENT WARPING'
Simplified Explanation
The abstract describes a printed circuit board (PCB) that has a metal layer and a via. The via is connected to a specific part of the metal layer, which forms a flange of a beam structure within the PCB. The via itself forms a web of the beam structure.
Original Abstract Submitted
A printed circuit board (PCB) includes a metal layer and a via. The via is coupled to a portion of the metal layer. The portion of the metal layer forms a flange of a beam structure in the PCB. The via forms a web of the beam structure in the PCB.
