US Patent Application 17728586. METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING simplified abstract
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING
Organization Name
Inventor(s)
Bret K. Street of Meridian ID (US)
Amy R. Griffin of Boise ID (US)
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17728586 Titled 'METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING'
Simplified Explanation
The abstract describes a semiconductor device assembly that uses carbon nanofibers (CNFs) to dissipate heat. The CNFs are covered with a molding compound to create an encapsulated layer. The molding compound fills the spaces between the individual CNFs, but the upper edges of some CNFs are exposed on the top surface of the encapsulated layer. The top surface of the CNF layer can be easily removed and attached to a carrier wafer.
Original Abstract Submitted
A semiconductor device assembly that includes carbon nanofibers (CNFs) for heat dissipation has a CNF layer. Molding compound encapsulates the CNF layer to form an encapsulated CNF layer. The molding compound extends between individual adjacent CNFs within the encapsulated CNF layer, and upper edges of at least a portion of individual CNFs within the encapsulated CNF layer are exposed along an upper surface of the encapsulated CNF layer. The upper surface of the CNF layer is removably attached to a bottom surface of a carrier wafer.
