US Patent Application 17728131. HATCHING GROUND UNDER A PAD IN A PRINTED CIRCUIT BOARD simplified abstract
Contents
HATCHING GROUND UNDER A PAD IN A PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Bhyrav Mutnury of Austin TX (US)
HATCHING GROUND UNDER A PAD IN A PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17728131 Titled 'HATCHING GROUND UNDER A PAD IN A PRINTED CIRCUIT BOARD'
Simplified Explanation
This abstract describes an information handling system that includes a printed circuit board. The circuit board has two sets of pads, one for a differential pair and the other for a ground. The pads for the differential pair are located on the surface of the board, while the ground is routed within the first layer of the board. The traces for the differential pair are located below the pads and the ground within the second layer of the board. The purpose of the ground is to reduce interference between the signals on the traces and the signals on the differential pair pads.
Original Abstract Submitted
An information handling system includes a printed circuit board. The printed circuit board includes first and second pads of a first differential pair, a hatched ground, and first and second traces of a second differential pair. The first and second pads of the first differential pair are routed a surface of the printed circuit board. The hatched ground routed within a first layer of the printed circuit board. The first and second traces of the second differential pair are routed below the first and second pads and the hatched ground within a second layer of the printed circuit board. The hatched ground dampens crosstalk between signals on the traces and signals on the differential pair pads.
