US Patent Application 17726235. DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD simplified abstract
Contents
DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Chang-Kai Chu of Zhongli District (TW)
Chang-Hsien Chen of New Taipei City (TW)
Bhyrav Mutnury of Austin TX (US)
DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17726235 Titled 'DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD'
Simplified Explanation
This abstract describes an information handling system that has a printed circuit board with a signal via. The signal via is made up of a conductive metal plating and has two parts called via portions. One via portion is connected to a first trace of a differential pair, while the other via portion is connected to a second trace of the differential pair. Both via portions are formed within the conductive metal plating.
Original Abstract Submitted
An information handling system includes a printed circuit board having a signal via fabricated through the printed circuit board. The signal via includes a conductive metal plating. The signal via also includes first and second via portions. The first via portion is connected to a first trace of a differential pair. The second via portion is connected to a second trace of the differential pair. The first and second via portions are formed in the conductive metal plating.
