US Patent Application 17725422. 3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING simplified abstract
Contents
3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING
Organization Name
Microsoft Technology Licensing, LLC
Inventor(s)
Bharath Ramakrishnan of Bellevue WA (US)
Husam Atallah Alissa of Redmond WA (US)
Eric C. Peterson of Woodinville WA (US)
Christian L. Belady of Mercer Island WA (US)
3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17725422 Titled '3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING'
Simplified Explanation
The abstract describes a processor that consists of two separate components connected by a microfluidic volume. Inside this volume, there is at least one pin fin, which is a small, thin structure. The pin fin has a boiling enhancement surface feature on its surface.
Original Abstract Submitted
A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.
