US Patent Application 17662032. ON-DIE CHIP-TO-CHIP (C2C) LINK STATE MONITOR simplified abstract
Contents
ON-DIE CHIP-TO-CHIP (C2C) LINK STATE MONITOR
Organization Name
Inventor(s)
Ramesh Krishnamurthy Madhira of San Jose CA (US)
Ibrahim Ouda of Austin TX (US)
Kaushik Roychowdhury of Austin TX (US)
ON-DIE CHIP-TO-CHIP (C2C) LINK STATE MONITOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 17662032 titled 'ON-DIE CHIP-TO-CHIP (C2C) LINK STATE MONITOR
Simplified Explanation
The patent application describes techniques for chip-to-chip serial communications, specifically for communication between chiplets on a multi-chip package.
- The method involves monitoring the state of the chip-to-chip link on the die.
- When a change in link state is detected, information about the change is stored in an on-die first-in, first-out (FIFO) buffer.
- The stored information includes the previous link state, the duration of time the link was in that state, and the speed of the link in that state.
- When a request for link state change information is received, the information is retrieved from the FIFO buffer.
- The retrieved information is then transmitted serially to an output pin on the die, such as a general purpose input/output (GPIO) pin.
Original Abstract Submitted
Disclosed are techniques for chip-to-chip (C2C) serial communications, such as communications between chiplets on a multi-chip package. In some aspects, a method of on-die monitoring of C2C links comprises detecting a change of the C2C link from a first link state to a second link state and storing link state change information in an on-die first-in, first-out (FIFO) buffer. The link state change information indicates the first link state, the duration of time the C2C link was in the first link state, and the speed of the C2C link in the first link state. Upon detecting a request for link state change information, link state change information is retrieved from the FIFO buffer and transmitted serially to an output pin of the die, such as a general purpose input/output (GPIO) pin.
