US Patent Application 17661838. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
Contents
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsuan-Ying Peng of Hsinchu City (TW)
Chin-Szu Lee of Taoyuan City (TW)
Chiang Hsien Shih of Hsinchu (TW)
Chih-Chang Wu of Hsinchu City (TW)
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17661838 titled 'SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
Simplified Explanation
- The patent application describes a deposition tool that includes a grounding component to improve the yield of semiconductor products. - The grounding component includes a grounding strap with a deformation region that has a recessed edge to reduce rubbing against a surface of the pumping plate component during operation. - The material properties of the grounding strap are designed to reduce plastic deformation during repeated cycling. - By reducing the amount of particulates dislodged from the pumping plate component, the yield of semiconductor products can be improved. - The frequency of servicing the grounding component can be decreased, resulting in decreased downtime of the deposition tool and increased throughput of semiconductor products.
Original Abstract Submitted
Some implementations described herein provide a deposition tool that includes a grounding component between an edge ring of a substrate stage and a pumping plate component. The grounding component includes a grounding strap having a deformation region. The deformation region includes a recessed edge to reduce a likelihood of the grounding strap rubbing against a surface of the pumping plate component during operation of the deposition tool. Material properties of the grounding strap may reduce a likelihood of plastic deformation of the grounding strap during repeated cycling. In this way, an amount of particulates dislodged from the surface of the pumping plate component may be decreased to improve a yield of semiconductor product fabricated using the deposition tool. Furthermore, a frequency of servicing the grounding component may be decreased to decrease a downtime of the deposition tool and increase a throughput of semiconductor product fabricated using the deposition tool.
