US Patent Application 17660767. MICROELECTRONIC DEVICES INCLUDING A SELECTIVELY REMOVABLE CAP DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS simplified abstract
MICROELECTRONIC DEVICES INCLUDING A SELECTIVELY REMOVABLE CAP DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS
Organization Name
Inventor(s)
Frank Speetjens of Boise ID (US)
Brendan Flynn of Boise ID (US)
S M Istiaque Hossain of Boise ID (US)
MICROELECTRONIC DEVICES INCLUDING A SELECTIVELY REMOVABLE CAP DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17660767 Titled 'MICROELECTRONIC DEVICES INCLUDING A SELECTIVELY REMOVABLE CAP DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS'
Simplified Explanation
The abstract describes a microelectronic device that consists of layers of different materials, including dielectric and conductive materials. There is also a cap oxide material located above these layers. The device also includes pillars that extend vertically through the layers. The cap oxide material is designed to have a different etch rate compared to the oxide material in the layers. The abstract also mentions that there are other microelectronic devices, systems, and methods of forming such devices that are disclosed in the document.
Original Abstract Submitted
A microelectronic device includes tiers of alternating dielectric and conductive materials, a cap oxide material vertically adjacent to the tiers, and pillars extending vertically through the tiers. The cap oxide material is formulated to exhibit a different etch rate relative to an etch rate of the oxide material of the tiers. Additional microelectronic devices, microelectronic systems, and methods of forming a microelectronic device are also disclosed.
