US Patent Application 17629600. TECHNIQUES TO MITIGATE MEMORY DIE MISALIGNMENT simplified abstract

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TECHNIQUES TO MITIGATE MEMORY DIE MISALIGNMENT

Organization Name

Micron Technology, Inc.


Inventor(s)

Jie Yang of Shanghai (CN)

Xu Zhang of Shanghai (CN)

Bin Zhao of Shanghai (CN)

TECHNIQUES TO MITIGATE MEMORY DIE MISALIGNMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17629600 titled 'TECHNIQUES TO MITIGATE MEMORY DIE MISALIGNMENT

Simplified Explanation

The patent application describes methods, systems, and devices for mitigating memory die misalignment.

  • Memory systems may receive commands to write data to a memory device.
  • The system determines if the data satisfies a threshold size.
  • If the data satisfies the threshold size, the system checks if the data in the write buffer aligns with the boundary of the memory die.
  • Adding the data to the buffer may result in die misalignment.
  • To mitigate die misalignment, the system pads the data in the write buffer with dummy data.
  • The padding aligns the data with the die boundary.


Original Abstract Submitted

Methods, systems, and devices for mitigating memory die misalignment are described. A memory system may receive a command to write data to a memory device including a memory die. The memory system may determine whether the data indicated by the command (e.g., a first set of data) satisfies a threshold size. If the first set of data satisfies the threshold size, the memory system may determine whether data currently in a write buffer aligns with a boundary of the memory die. For example, depending on the data currently in the buffer, adding the first set of data to the buffer may result in die misalignment for the first set of data. To mitigate die misalignment, the memory system may pad data (e.g., add dummy data) to the write buffer, such that the padding aligns the data with the die boundary.