US Patent Application 17425880. EXTRUDABLE PRESSURE-SENSITIVE ADHESIVE simplified abstract
Contents
EXTRUDABLE PRESSURE-SENSITIVE ADHESIVE
Organization Name
3M INNOVATIVE PROPERTIES COMPANY
Inventor(s)
Mark E. Napierala of St. Paul MN (US)
Thomas Q. Chastek of St. Paul MN (US)
Robert D. Waid of Maplewood MN (US)
Ross E. Behling of Woodbury MN (US)
Shaun M. West of St. Paul MN (US)
Jacob D. Young of St. Paul MN (US)
EXTRUDABLE PRESSURE-SENSITIVE ADHESIVE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17425880 titled 'EXTRUDABLE PRESSURE-SENSITIVE ADHESIVE
Simplified Explanation
- The patent application describes methods of bonding a pressure-sensitive adhesive to a substrate. - The methods involve heating a styrenic block copolymer composition to create an adhesive melt composition. - The styrenic block copolymer composition contains a hard segment block with a specific glass transition temperature range. - The adhesive melt composition is then masticated and delivered onto the substrate at a temperature higher than the glass transition temperature of the hard segment block. - The adhesive melt composition is cooled to create a bonded pressure-sensitive adhesive. - The substrate can be a non-film substrate, and the styrenic block copolymer composition can be provided in a core-sheath filament with a non-tacky sheath at ambient temperature.
Original Abstract Submitted
Methods of bonding a pressure-sensitive adhesive to a substrate are provided. The methods include heating a styrenic block copolymer composition to provide an adhesive melt composition, wherein the styrenic block copolymer composition contains a hard segment block with a glass transition temperature of from 90° C. to 220° C.; masticating the adhesive melt composition; delivering the adhesive melt composition onto the substrate at a temperature that exceeds the glass transition temperature of the hard segment block by from 20° C. to 150° C.; and cooling the adhesive melt composition to obtain a bonded pressure-sensitive adhesive. Optionally, the substrate can be a non-film substrate, or the styrenic block copolymer composition can be provided in a core-sheath filament that includes a styrenic block copolymer core and a sheath that is non-tacky at ambient temperature.
