Toyota jidosha kabushiki kaisha (20240133069). FILM FORMING APPARATUS FOR FORMING METAL FILM simplified abstract
Contents
- 1 FILM FORMING APPARATUS FOR FORMING METAL FILM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FILM FORMING APPARATUS FOR FORMING METAL FILM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FILM FORMING APPARATUS FOR FORMING METAL FILM
Organization Name
toyota jidosha kabushiki kaisha
Inventor(s)
Haruki Kondoh of Okazaki-shi (JP)
Keiji Kuroda of Toyota-shi (JP)
Koji Inagaki of Toyota-shi (JP)
FILM FORMING APPARATUS FOR FORMING METAL FILM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240133069 titled 'FILM FORMING APPARATUS FOR FORMING METAL FILM
Simplified Explanation
The film forming apparatus described in the patent application includes a pressing mechanism that applies fluid pressure from a plating solution to the mask structure, which consists of a screen mask with a predetermined pattern and a frame supporting the mask on the substrate side. The frame has an inner covering portion made of a softer elastic material along the opening edge that contacts the electrolyte membrane.
- Pressing mechanism applies fluid pressure to mask structure
- Mask structure consists of screen mask and frame with inner covering portion
- Inner covering portion made of softer elastic material
Potential Applications
The technology described in the patent application could be used in the manufacturing of electronic devices, such as printed circuit boards, by facilitating the formation of precise patterns on substrates.
Problems Solved
This technology solves the problem of ensuring uniform and accurate deposition of materials on substrates by providing a mechanism to press the mask structure securely against the substrate.
Benefits
The benefits of this technology include improved precision in pattern formation, increased efficiency in manufacturing processes, and enhanced quality control in the production of electronic devices.
Potential Commercial Applications
A potential commercial application of this technology could be in the semiconductor industry for the production of integrated circuits, where precise patterning is crucial for device functionality.
Possible Prior Art
One possible prior art for this technology could be similar film forming apparatus used in the semiconductor industry for photolithography processes.
What is the specific composition of the softer elastic material used in the inner covering portion of the frame?
The specific composition of the softer elastic material used in the inner covering portion of the frame is not provided in the abstract. Further details on the material properties and characteristics would be necessary to understand its performance and suitability for the application.
How does the fluid pressure from the plating solution impact the deposition process on the substrate?
The abstract does not elaborate on how the fluid pressure from the plating solution affects the deposition process on the substrate. Understanding the relationship between the pressure applied and the resulting deposition quality would be essential for optimizing the manufacturing process.
Original Abstract Submitted
the film forming apparatus includes a pressing mechanism that presses the mask structure by the electrolyte membrane with a fluid pressure of a plating solution. the mask structure includes a screen mask in which a penetrating portion corresponding to a predetermined pattern is formed, and a frame that supports a peripheral edge of the screen mask on a side adjacent to the substrate. in the frame, an inner covering portion made of an elastic material softer than a material of the frame is formed along an opening edge contacting the electrolyte membrane.
