Texas instruments incorporated (20240113063). RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS simplified abstract
Contents
- 1 RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
Organization Name
texas instruments incorporated
Inventor(s)
Udit Rawat of West Lafayette IN (US)
Swaminathan Sankaran of Allen TX (US)
Baher S. Haroun of Allen TX (US)
RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113063 titled 'RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
Simplified Explanation
The semiconductor die in this patent application comprises a semiconductor substrate with a radiator layer on the surface, including a metal member with two portions at different distances from the surface, and a piezoelectric layer between the metal members and the substrate.
- The semiconductor die includes a semiconductor substrate with a surface divided into first and second portions, and a radiator layer made of a metal member with two portions at different distances from the surface.
- The radiator layer also contains first and second electrodes, as well as a piezoelectric layer between the metal members and the substrate.
Potential Applications
This technology could be applied in:
- Semiconductor devices
- Electronic components
- Thermal management systems
Problems Solved
This technology helps in:
- Improving heat dissipation in semiconductor devices
- Enhancing the performance and reliability of electronic components
- Providing efficient thermal management solutions
Benefits
The benefits of this technology include:
- Increased efficiency of semiconductor devices
- Enhanced reliability of electronic components
- Improved thermal performance
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive industry
- Aerospace sector
Possible Prior Art
One possible prior art could be:
- Existing semiconductor die designs with radiator layers and metal members.
Unanswered Questions
How does this technology compare to traditional cooling methods in semiconductor devices?
This technology offers improved heat dissipation compared to traditional cooling methods by utilizing the piezoelectric layer for enhanced thermal management.
What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing?
One potential challenge could be the cost of production and integration of the piezoelectric layer in semiconductor devices, which may require additional manufacturing processes and materials.
Original Abstract Submitted
in examples, a semiconductor die comprises a semiconductor substrate having a surface, the surface having first and second surface portions, and a radiator layer on the surface. the radiator layer comprises a metal member having a first metal member portion above the first surface portion and a second metal member portion above the second surface portion, a first distance between the first metal member portion and the first surface portion, and a second distance between the second metal member portion and the second surface portion, the first distance less than the second distance. the radiator layer includes first and second electrodes. the radiator layer includes a piezoelectric layer extending along a length of the radiator layer and on each of the first and second electrodes, the piezoelectric layer between the first and second metal members and the semiconductor substrate.
