Taiwan semiconductor manufacturing company, ltd. (20240134268). LITHOGRAPHY MASK simplified abstract

LITHOGRAPHY MASK

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chien-Cheng Chen of Hsinchu County (TW)

Huan-Ling Lee of Hsinchu County (TW)

Ta-Cheng Lien of Hsinchu County (TW)

Chia-Jen Chen of Hsinchu County (TW)

Hsin-Chang Lee of Hsinchu County (TW)

LITHOGRAPHY MASK - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240134268 titled 'LITHOGRAPHY MASK

Simplified Explanation

The abstract describes a mask for use in a semiconductor lithography process, which includes a substrate, a mask pattern, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the border.

• The mask for semiconductor lithography process includes:

 - Substrate
 - Mask pattern
 - Light absorbing border surrounding the mask pattern
 - Peripheral region outside the light absorbing border

• The light absorbing border is inset from at least two edges of the substrate.
• A first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate.
• A second peripheral region extends from the outer perimeter of the light absorbing border to a second edge of the substrate.
• The first edge and second edge of the substrate are on opposite sides of the mask pattern.

Potential Applications

This technology can be applied in the semiconductor industry for lithography processes to improve the accuracy and quality of mask patterns.

Problems Solved

1. Reduced light reflection and scattering during lithography processes. 2. Enhanced precision and resolution in defining mask patterns.

Benefits

1. Improved semiconductor manufacturing processes. 2. Higher quality and more precise mask patterns. 3. Enhanced performance of semiconductor devices.

Potential Commercial Applications

Optimizing lithography processes in semiconductor manufacturing for improved product quality and performance.

Possible Prior Art

There may be prior art related to the use of light absorbing borders in semiconductor lithography processes, but specific examples are not provided in the abstract.

Unanswered Questions

How does the light absorbing border impact the overall efficiency of the lithography process?

The efficiency of the lithography process can be affected by the light absorbing border, as it helps reduce light reflection and scattering, leading to more accurate and precise mask patterns.

What are the potential cost implications of implementing this technology in semiconductor manufacturing?

The cost implications of implementing this technology may include initial investment in new equipment or processes, but the long-term benefits of improved quality and performance could outweigh the initial costs.

Original Abstract Submitted

a mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. the light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. in some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.