Taiwan semiconductor manufacturing company, ltd. (20240120313). CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE simplified abstract

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Sheng-Yao Yang of Hsinchu City (TW)

Ling-Wei Li of Hsinchu City (TW)

Yu-Jui Wu of Hsinchu City (TW)

Cheng-Lin Huang of Hsinchu City (TW)

Chien-Chen Li of Hsinchu (TW)

Lieh-Chuan Chen of Hsinchu City (TW)

Che-Jung Chu of Hsinchu City (TW)

Kuo-Chio Liu of Hsinchu City (TW)

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240120313 titled 'CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

Simplified Explanation

The chip package structure described in the patent application includes a chip with a conductive ring-like structure that surrounds a central region of the chip. Additionally, there is a first solder structure over the conductive ring-like structure, with the two structures being made of different materials.

• The chip package structure includes a chip with a conductive ring-like structure.
• The conductive ring-like structure surrounds a central region of the chip.
• There is a first solder structure over the conductive ring-like structure.
• The first solder structure and the conductive ring-like structure are made of different materials.

Potential Applications

The technology described in the patent application could be applied in:

• Electronic devices
• Semiconductor manufacturing

Problems Solved

This technology helps in:

• Enhancing electrical insulation
• Improving soldering processes

Benefits

The benefits of this technology include:

• Increased reliability
• Better performance

Potential Commercial Applications

The potential commercial applications of this technology could be in:

• Consumer electronics
• Automotive industry

Possible Prior Art

One possible prior art for this technology could be:

• Existing chip package structures with conductive elements

How does this technology compare to existing chip package structures in terms of cost-effectiveness?

This article does not provide information on the cost-effectiveness of the technology compared to existing chip package structures.

What impact does the use of different materials for the solder structure and the conductive ring-like structure have on the overall performance of the chip package structure?

This article does not address the specific impact of using different materials on the performance of the chip package structure.

Original Abstract Submitted

a chip package structure is provided. the chip package structure includes a chip. the chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. the conductive ring-like structure surrounds a central region of the chip. the chip package structure includes a first solder structure over the conductive ring-like structure. the first solder structure and the conductive ring-like structure are made of different materials.