Taiwan semiconductor manufacturing company, ltd. (20240107781). Optical Device and Method of Manufacture simplified abstract
Contents
- 1 Optical Device and Method of Manufacture
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Optical Device and Method of Manufacture - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Optical Device and Method of Manufacture
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
Jui Lin Chao of New Taipei City (TW)
Optical Device and Method of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107781 titled 'Optical Device and Method of Manufacture
Simplified Explanation
The abstract describes a patent application for optical devices and methods of manufacture involving forming an opening within a semiconductor device, bonding it to other optical devices, refilling the opening with a laser die or fill material, and electrically connecting the semiconductor device to an optical interposer.
- Opening formed within a first semiconductor device
- Bonding the semiconductor device to other optical devices
- Refilling the opening with a laser die or fill material
- Electrically connecting the semiconductor device to an optical interposer
Potential Applications
The technology described in the patent application could be applied in the manufacturing of advanced optical devices, such as sensors, communication systems, and imaging devices.
Problems Solved
This technology solves the problem of efficiently integrating different optical components by providing a method for bonding semiconductor devices and refilling openings with fill material.
Benefits
The benefits of this technology include improved performance and reliability of optical devices, as well as potentially reducing manufacturing costs through a more streamlined process.
Potential Commercial Applications
The technology could have commercial applications in industries such as telecommunications, medical imaging, and aerospace, where advanced optical devices are in high demand.
Possible Prior Art
One possible prior art for this technology could be the use of bonding techniques in semiconductor manufacturing processes to integrate different components.
What are the specific materials used for refilling the opening in the semiconductor device?
The specific materials used for refilling the opening in the semiconductor device are not mentioned in the abstract.
How does the electrical connection between the semiconductor device and the optical interposer work?
The abstract does not provide details on how the electrical connection between the semiconductor device and the optical interposer is established.
Original Abstract Submitted
optical devices and methods of manufacture are presented in which an opening is formed within a first semiconductor device and then bonded to other optical devices. a laser die or other fill material may be used to refill the opening. the first semiconductor device is then electrically connected to an optical interposer.
