Taiwan semiconductor manufacturing company, ltd. (20240105751). SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chung-Lei Chen of Hsinchu (TW)
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105751 titled 'SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
Simplified Explanation
The semiconductor device described in the patent application includes a substrate with two devices, one of which contains a photo-sensitive element. The first device is surrounded by a first isolation feature with a greater depth than the second isolation feature surrounding the second device.
- The patent application describes a semiconductor device with two devices on a substrate, one of which includes a photo-sensitive element.
- The first device is enclosed by a first isolation feature with a greater depth compared to the second isolation feature surrounding the second device.
Potential Applications
The technology described in the patent application could be applied in:
- Photovoltaic cells
- Image sensors
- Optical communication devices
Problems Solved
The technology addresses the following issues:
- Isolation of photo-sensitive elements in semiconductor devices
- Ensuring proper functioning of photo-sensitive elements in close proximity to other devices
Benefits
The benefits of this technology include:
- Improved performance of photo-sensitive elements
- Enhanced reliability of semiconductor devices
- Better integration of photo-sensitive elements in semiconductor devices
Potential Commercial Applications
The technology could be utilized in various commercial applications such as:
- Consumer electronics
- Solar energy systems
- Medical imaging devices
Possible Prior Art
One possible prior art could be the use of different isolation features in semiconductor devices to protect sensitive elements.
Unanswered Questions
How does this technology compare to existing isolation techniques in semiconductor devices?
The patent application does not provide a direct comparison to existing isolation techniques in semiconductor devices. It would be beneficial to understand the specific advantages of this technology over traditional methods.
What are the potential limitations or challenges in implementing this technology on a larger scale?
The patent application does not address any potential limitations or challenges in scaling up the implementation of this technology. It would be important to consider factors such as cost, manufacturing complexity, and compatibility with existing processes.
Original Abstract Submitted
a semiconductor device includes a substrate having a first device and a second device, where at least one of the first device and the second device includes a photo-sensitive element. the semiconductor device includes a first isolation feature surrounding the first device, where the first isolation feature has a first depth. the semiconductor device includes a second isolation feature surrounding the second device, where the second isolation feature has a second depth and where the first depth is greater than the second depth.
