Taiwan semiconductor manufacturing co., ltd. (20240127887). STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE simplified abstract

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STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Hiroki Noguchi of Hsinchu City (TW)

Ku-Feng Lin of New Taipei City (TW)

STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240127887 titled 'STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE

Simplified Explanation

The memory device described in the abstract includes sense amplifiers and a reference cell, with the sense amplifiers transmitting a read current and the reference cell having a decreased resistance value as the number of sense amplifiers increases.

  • Sense amplifiers with first and second terminals are connected to a memory cell block.
  • The second terminals of the sense amplifiers are coupled together to transmit a read current.
  • The reference cell transmits the read current to a ground terminal.
  • The resistance value of the reference cell decreases as the number of sense amplifiers increases.

Potential Applications

The technology described in this patent application could be applied in:

  • Solid-state drives
  • Computer memory modules
  • Embedded systems

Problems Solved

This technology helps in:

  • Improving memory read performance
  • Reducing power consumption
  • Enhancing data storage reliability

Benefits

The benefits of this technology include:

  • Faster read speeds
  • Lower energy consumption
  • Increased data integrity

Potential Commercial Applications

The potential commercial applications of this technology could be seen in:

  • Consumer electronics
  • Data centers
  • Automotive electronics

Possible Prior Art

One possible prior art for this technology could be the use of reference cells in memory devices to improve read performance and reduce power consumption.

Unanswered Questions

How does this technology compare to existing memory devices in terms of read speed and power consumption?

This article does not provide a direct comparison with existing memory devices in terms of read speed and power consumption. Further research or testing would be needed to make a comparison.

What are the potential limitations or drawbacks of implementing this technology in memory devices?

The article does not address any potential limitations or drawbacks of implementing this technology in memory devices. Further analysis or testing would be required to identify any such limitations.


Original Abstract Submitted

a memory device is provided. the memory device includes several sense amplifiers and at least one reference cell. each of the sense amplifiers has a first terminal and a second terminal. the first terminals of the sense amplifiers are coupled to a memory cell block, and the second terminals of the sense amplifiers are coupled together to transmit a read current. the at least one reference cell transmits the read current to a ground terminal. the at least one reference cell has a decreased resistance value when a number n of the sense amplifiers increases.