Taiwan semiconductor manufacturing co., ltd. (20240124298). Semiconductor Devices and Methods of Manufacture simplified abstract
Contents
- 1 Semiconductor Devices and Methods of Manufacture
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Semiconductor Devices and Methods of Manufacture - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Semiconductor Devices and Methods of Manufacture
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Yun-Chung Wu of Taipei City (TW)
Hao Chun Yang of New Taipei City (TW)
Pei-Wei Lee of Kaohsiung City (TW)
Wen-Hsiung Lu of Tainan City (TW)
Semiconductor Devices and Methods of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240124298 titled 'Semiconductor Devices and Methods of Manufacture
Simplified Explanation
The abstract describes a patent application related to microelectromechanical devices and methods of manufacture. The process involves bonding a mask substrate to a MEMS device, patterning the mask substrate, forming two conductive pillars of different heights within the mask substrate, and then removing the mask substrate.
- Explanation of the patent/innovation:
- Bonding a mask substrate to a MEMS device - Patterning the mask substrate - Forming two conductive pillars of different heights within the mask substrate - Removing the mask substrate
Potential Applications
This technology could be applied in the manufacturing of MEMS devices, sensors, actuators, and other microelectromechanical systems.
Problems Solved
This technology solves the problem of efficiently fabricating MEMS devices with complex structures and multiple components.
Benefits
The benefits of this technology include improved precision in manufacturing MEMS devices, the ability to create intricate designs, and potentially reducing production costs.
Potential Commercial Applications
- Optimizing MEMS device production processes for increased efficiency and cost-effectiveness
Possible Prior Art
There may be prior art related to MEMS device fabrication processes involving bonding, patterning, and forming conductive pillars within a substrate.
What are the specific materials used in the bonding process?
The specific materials used in the bonding process are not mentioned in the abstract.
How does the height difference between the two conductive pillars affect the performance of the MEMS device?
The abstract does not provide information on how the height difference between the two conductive pillars may impact the performance of the MEMS device.
Original Abstract Submitted
microelectromechanical devices and methods of manufacture are presented. embodiments include bonding a mask substrate to a first microelectromechanical system (mems) device. after the bonding has been performed, the mask substrate is patterned. a first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. the mask substrate is then removed.
