Taiwan semiconductor manufacturing co., ltd. (20240099022). PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE simplified abstract
Contents
- 1 PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Hai-Dang Trinh of Hsinchu (TW)
Fu-Ting Sung of Yangmei City (TW)
PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240099022 titled 'PHASE CHANGE MATERIAL (PCM) SWITCH HAVING LOW HEATER RESISTANCE
Simplified Explanation
The abstract describes an integrated chip (IC) with a phase change material (PCM) structure and a heating structure for efficient heat management.
- Dielectric structure over substrate
- PCM structure over dielectric structure
- First and second conductive structures over PCM structure
- Heating structure in dielectric structure between conductive structures
- Heating structure with first and second surfaces, where second surface is wider
- First surface faces PCM structure
Potential Applications
The technology described in the patent application could be applied in:
- High-performance computing systems
- Data centers
- Consumer electronics
Problems Solved
The innovation addresses issues related to:
- Heat dissipation in integrated circuits
- Thermal management in electronic devices
Benefits
The technology offers benefits such as:
- Improved performance and reliability of electronic devices
- Enhanced thermal efficiency
- Increased lifespan of integrated circuits
Potential Commercial Applications
The technology could find commercial applications in:
- Semiconductor industry
- Electronics manufacturing
- Thermal management solutions providers
Possible Prior Art
One possible prior art could be the use of traditional heating structures in integrated circuits for thermal management.
Unanswered Questions
How does the heating structure impact the overall power consumption of the IC?
The article does not provide information on the power consumption implications of the heating structure.
What materials are used in the construction of the heating structure?
The article does not specify the materials used in the heating structure construction.
Original Abstract Submitted
various embodiments of the present application are directed toward an integrated chip (ic). the ic comprises a dielectric structure disposed over a substrate. a phase change material (pcm) structure is disposed over the dielectric structure. a first conductive structure and a second conductive structure are disposed over and electrically coupled to the pcm structure. a heating structure is disposed in the dielectric structure and laterally between the first conductive structure and the second conductive structure. the heating structure has a first surface and a second surface opposite the first surface. the first surface faces the pcm structure. the first surface has a first width and the second surface has a second width that is greater than the first width.
