Taiwan semiconductor manufacturing co., ltd. (20240097027). SEMICONDUCTOR STRUCTURE simplified abstract
Contents
- 1 SEMICONDUCTOR STRUCTURE
SEMICONDUCTOR STRUCTURE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chia-Ming Pan of Tainan City (TW)
Chia-Ta Hsieh of Tainan City (TW)
Po-Wei Liu of Tainan City (TW)
Yun-Chi Wu of Tainan City (TW)
SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240097027 titled 'SEMICONDUCTOR STRUCTURE
Simplified Explanation
The semiconductor structure described in the abstract includes a semiconductor substrate with isolation structures and a conductive feature. The isolation structures are spaced apart from each other over the substrate, and the conductive feature extends vertically between them with a rounded corner adjoining one of the isolation structure sidewalls.
- Semiconductor structure with isolation structures and a conductive feature
- Isolation structures spaced apart over the semiconductor substrate
- Conductive feature extending vertically between isolation structures with a rounded corner
Potential Applications
The semiconductor structure with improved isolation and conductive features could be used in:
- Integrated circuits
- Semiconductor devices requiring precise electrical connections
Problems Solved
This technology addresses issues such as:
- Signal interference between components
- Electrical leakage in semiconductor devices
Benefits
The benefits of this technology include:
- Enhanced performance of semiconductor devices
- Improved reliability and efficiency of integrated circuits
Potential Commercial Applications
The semiconductor structure could have commercial applications in:
- Electronics manufacturing industry
- Semiconductor fabrication companies
Possible Prior Art
One possible prior art for this technology could be:
- Semiconductor structures with isolation features and conductive paths
Unanswered Questions
How does this technology improve the efficiency of integrated circuits?
This technology improves the efficiency of integrated circuits by reducing signal interference and electrical leakage, leading to better overall performance.
What are the specific advantages of the rounded corner feature in the conductive path?
The rounded corner feature in the conductive path helps to minimize signal distortion and improve the reliability of the electrical connection.
Original Abstract Submitted
a semiconductor structure includes a semiconductor substrate, first to third isolation structures, and a conductive feature. the first to third isolation structures are over the semiconductor substrate and spaced apart from each other. the semiconductor substrate comprises a region surrounded by a sidewall of the first isolation structure and a first sidewall of the second isolation structure. the conductive feature extends vertically in the semiconductor substrate and between the between the second and third isolation structures, wherein the conductive feature has a rounded corner adjoining a second sidewall of the second isolation structure opposite the first sidewall of the second isolation structure.
