Taiwan semiconductor manufacturing co., ltd. (20240096942). SEMICONDUCTOR DEVICE STRUCTURE simplified abstract

SEMICONDUCTOR DEVICE STRUCTURE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Jung-Chien Cheng of Tainan City (TW)

Kuo-Cheng Chiang of Hsinchu County (TW)

Shi Ning Ju of Hsinchu City (TW)

Guan-Lin Chen of Hsinchu County (TW)

Chih-Hao Wang of Hsinchu County (TW)

Kuan-Lun Cheng of Hsin-Chu (TW)

SEMICONDUCTOR DEVICE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096942 titled 'SEMICONDUCTOR DEVICE STRUCTURE

Simplified Explanation

The semiconductor structure described in the abstract includes a substrate with a p-type well or an n-type well, base portions, channel members, isolation features, and deep isolation structures.

• The semiconductor structure includes a substrate with a p-type well or an n-type well.
• It has a first base portion over the p-type well and a second base portion over the n-type well.
• The structure also includes a first plurality of channel members over the first base portion and a second plurality of channel members over the second base portion.
• An isolation feature is disposed between the first and second base portions.
• A deep isolation structure in the substrate is located below the isolation feature.

Potential Applications

The semiconductor structure can be used in:

• Integrated circuits
• Microprocessors
• Memory devices

Problems Solved

The semiconductor structure helps in:

• Enhancing performance of electronic devices
• Improving efficiency of semiconductor components

Benefits

The benefits of the semiconductor structure include:

• Increased speed and reliability of electronic devices
• Reduction in power consumption
• Enhanced overall performance of semiconductor devices

Potential Commercial Applications

The technology can be applied in:

• Consumer electronics
• Telecommunications
• Automotive industry

Possible Prior Art

One possible prior art could be the use of similar isolation features and deep isolation structures in semiconductor manufacturing processes.

Unanswered Questions

How does the semiconductor structure impact the overall cost of manufacturing electronic devices?

The abstract does not provide information on the cost implications of implementing this semiconductor structure in electronic devices. Further research or analysis would be needed to determine the cost-effectiveness of this technology.

What are the specific performance improvements achieved by the semiconductor structure compared to existing technologies?

The abstract does not detail the specific performance enhancements enabled by this semiconductor structure. Additional testing or comparative studies would be necessary to quantify the performance gains relative to other semiconductor structures.

Original Abstract Submitted

semiconductor structures and the manufacturing method thereof are disclosed. an exemplary semiconductor structure according to the present disclosure includes a substrate having a p-type well or an n-type well, a first base portion over the p-type well, a second base portion over the n-type well, a first plurality of channel members over the first base portion, a second plurality of channel members over the second base portion, an isolation feature disposed between the first base portion and the second base portion, and a deep isolation structure in the substrate disposed below the isolation feature.