Taiwan semiconductor manufacturing co., ltd. (20240096918). IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME simplified abstract

IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Hao-Lin Yang of Kaohsiung City (TW)

Tzu-Jui Wang of Kaohsiung County (TW)

Wei-Cheng Hsu of Kaohsiung City (TW)

Cheng-Jong Wang of Hsin-Chu (TW)

Dun-Nian Yuang of Taipei City (TW)

Kuan-Chieh Huang of Hsinchu City (TW)

IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096918 titled 'IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME

Simplified Explanation

The device structure described in the abstract includes multiple dies with interconnect structures and substrates bonded together. Here are the key points explained in bullet points:

• First die with first substrate and interconnect structure
• Second die with second substrate and interconnect structure
• Third die with third interconnect structure and substrate containing photodiodes and a transistor
• Bonding layers connecting the interconnect structures of the dies
• Transistors on the second die interconnected in a specific configuration

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1. 1. 1. Potential Applications

The technology described in this patent application could potentially be applied in the following areas:

• Semiconductor manufacturing
• Integrated circuit design
• Sensor technology development

1. 1. 1. Problems Solved

This technology helps address the following issues:

• Efficient bonding of multiple dies with different functionalities
• Integration of photodiodes and transistors in a compact structure
• Interconnection of transistors in a specific configuration

1. 1. 1. Benefits

The benefits of this technology include:

• Improved performance of integrated circuits
• Enhanced functionality of sensors
• Compact and efficient device structure

1. 1. 1. Potential Commercial Applications

The potential commercial applications of this technology could include:

• Consumer electronics
• Medical devices
• Automotive sensors

1. 1. 1. Possible Prior Art

One possible prior art related to this technology could be the development of multi-die packaging techniques in semiconductor industry.

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1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does this technology compare to existing multi-die packaging solutions?

The article does not provide a direct comparison with existing multi-die packaging solutions in terms of performance, cost, or efficiency.

1. 1. 1. 1. What specific manufacturing processes are involved in bonding the interconnect structures of the dies?

The article does not delve into the specific manufacturing processes or techniques used for bonding the interconnect structures of the dies.

Original Abstract Submitted

a device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. the first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. the second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. the third substrate includes a plurality of photodiodes and a first transistor. the second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.